Mobile chip maker Qualcomm has offered the first look at its third generation 5G modem, but it won’t appear in devices for a year.
The Snapdragon X60 5G Modem-RF System, to use its full name, will be the first of any kind to incorporate a baseband that’s manufactured on the 5nm process. This means the silicon can do more processing and use less power then older manufacturing processes. Other than that the headline new features concern carrier aggregation.
Not only will the X60 support CA across all 5G bands, including mmWave, it will also let you combine FDD and TDD streams. The significance of this kind of CA flexibility is that, in principle, it will allow operators to cobble together whatever bits of spectrum they find down the back of the sofa in a bid to deliver on the many promises made on behalf of 5G.
“Qualcomm Technologies is at the heart of 5G launches globally with mobile operators and OEMs introducing 5G services and mobile devices at record pace,” said Cristiano Amon, Qualcomm President. “As 5G standalone networks are introduced in 2020, our third-generation 5G modem-RF platform brings extensive spectrum aggregation capabilities and options to fuel the rapid expansion of 5G rollouts while enhancing coverage, power efficiency and performance for mobile devices. We are excited about the fast adoption of 5G across geographies and the positive impact 5G is having on the user experience.”
There’s not that much else to add for now, since this new product portfolio is still some way from existing in the wild. AnandTech did a comprehensive-looking deep dive here, if you fancy geeking out a bit on this, and there’s also the vid below. What does seem likely is that Qualcomm will maintain its 5G modem leadership for the foreseeable future.