Mobile chip giant Qualcomm dragged the industry over to Hawaii so they could hear about some of the new stuff it has lined up for next year.
You’ll be amazed to hear that Qualcomm reckons 5G is going to be a big deal and that it expects to be a big part of that. “5G will open new and exciting opportunities to connect, compute, and communicate in ways we’ve yet to imagine and we are happy to be a key player driving the adoption of 5G around the world,” said Qualcomm President Cristiano Amon, presumably having had to be dragged away from a Mai Tai to manage even that.
At the vanguard of Qualcomm’s 2020 5G push will, of course, be it’s Snapdragon SoCs, which tend to find their way into the mobile devices made by any vendor that can’t be bothered to make its own chips. The flagship Snapdragon next year will be the 865, which will include the X55 5G modem. One rung further down the value chain will be the 765, see how it works?
The other main announcement on the first day in Maui is an updated version of Qualcomm’s ‘3D sonic fingerprint technology’. Apparently the new, improved version offers a 17x lager recognition area as well as other improvements. The keynote didn’t seem to address the hassle Samsung recently had with the technology, which presumably led to a bit of a diplomatic incident between the companies. Cnet, however, had a chat with Qualcomm about that very topic, which you can read here.
Lastly, for those of you either not invited or disinclined to schlep half way around the world for a spot of sub-tropical death-by-PowerPoint, Qualcomm thoughtfully recorded the Day 1 keynotes and put them of YouTube, which you can see below.